Tech
MediaTek Dimensity 9600 series: Specs, benchmark score, and everything else we know 🏁
MediaTek is coming for the crown 👑. With a massive 5.0GHz clock speed ⚡, the world’s first 2nm architecture 🔬, and a brand-new “Pro” tier 🆕, the Dimensity 9600 is set to redefine flagship performance 🚀. From powering OpenAI’s first smartphone 🤖📱 to hardware-level gaming boosts 🎮, here is your first look at the chip that is about to change everything 🌍.
In a few months, MediaTek will launch Dimensity 9600 chips 🗓️, which will power the next-generation of flagship smartphones 📲. Alongside the Dimensity 9600, the chipmaker is also expected to unveil the Dimensity 9600 Pro as the company’s first Pro-branded mobile processor with huge upgrades 💎.
While we’re still months away from the official launch ⏳, which is likely to happen in September, leaks have already spilled enough details about the upcoming Dimensity flagships to show us what’s to come 🕵️♂️.
[Note 📝: MediaTek hasn’t officially revealed any details about the upcoming Dimensity 9600 and Dimensity 9600 Pro, so all the details in the post are purely based on leaks and rumors 🤫.]

MediaTek Dimensity 9600 series: Spec sheet 📋
Dimensity 9600 Dimensity 9600 Pro
Launch 📅 September 2026 September 2026
Process node 🏗️ 2 nm (TSMC) 2 nm (TSMC)
CPU 🧠 2 x prime cores
3 x performance cores
3 x efficiency cores 2 x prime cores
3 x performance cores
3 x performance cores
Peak CPU speed 🏎️ ~4.X GHz ~5.0 GHz
GPU 🎨 Arm Immortalis “Magni”
ray tracing support ✨ Arm Immortalis “Magni” (higher core count)
ray tracing support ✨
Memory 💾 LPDDR5X LPDDR6
Storage 📦 UFS 4.0 UFS 5.0
MediaTek Dimensity 9600 series: Everything you need to know 💡
MediaTek will split its next-gen tier into a standard Dimensity 9600 and a high-performance Dimensity 9600 Pro 🧬. Not just MediaTek but Qualcomm will introduce a “Pro” version of its upcoming Snapdragon 8 Elite Gen 6 chip around the same time later this year 🐉.
The battle is going to be more intense this year ⚔️ as the Dimensity 9600 Pro reportedly brings major performance upgrades and will closely compete with the best from Apple and Qualcomm 🆚.
Process node and CPU architecture 🏭
The Dimensity 9600 Pro will reportedly utilize TSMC’s advanced 2nm (N2P) node 🔬. This could offer a 10–15% performance boost and a 25–30% improvement in power efficiency compared to the previous generation 🔋. However, uncertainty remains regarding whether the standard Dimensity 9600 will use the same node ⚖️.
TSMC’s factories are unable to meet the unprecedented demand for high-performance chips, and so, securing a supply of advanced nodes is a big battle in itself 🏭💥. And to keep the cost in check, the standard Dimensity 9600 may use the 3nm node, or it could be a lower-binned 2nm chip 📉.
Besides an advanced node, the Dimensity 9600 Pro is reportedly getting a major CPU architecture upgrade 🏗️. Instead of a traditional ‘1+3+4’ design, the Pro chip may use a ‘2+3+3’ configuration, featuring two Ultra cores with a 5.0 GHz peak frequency ⚡. The standard Dimensity 9600 may also use the new configuration, but will likely have a lower peak frequency 🏎️.

The Ultra cores are rumored to be Arm’s next-gen Cortex C2-Ultra codenamed “Canyon” 🏔️. The three performance cores are codenamed “Gelas-B” and the three balanced performance cores are codenamed “Gelas” 🌀.
GPU and gaming capabilities 🕹️
The Dimensity 9600 chips are reportedly getting huge graphics advancements, designed to rival or beat top-tier chips from rivals 🎮. Both variants are said to feature Arm’s next-generation “Magni” GPU architecture, but the Pro chip may have higher core counts 🖼️.
Furthermore, the chip could feature integrated dedicated hardware blocks directly into the silicon to offload heavy gaming tasks 🛠️. According to leakster Digital Chat Station, the chip can artificially insert frames into games at a hardware level, allowing a game running at 60 FPS to be smoothly scaled to 120 FPS or higher 🚀. The Magni GPU is also said to have native resolution upscaling rather than relying purely on software tricks 📺.
The chips reportedly feature upgraded ray tracing performance, resulting in more realistic lighting, shadows, and reflections in modern titles ✨. Furthermore, the Dimensity 9600 Pro is said to support LPDDR6 RAM and UFS 5.0 storage, which should greatly improve data transfer speeds, resulting in faster game launches and faster loading of gaming assets ⚡📂.
AI and NPU capabilities 🤖
MediaTek is said to have greatly improved the AI capabilities on the Dimensity 9600 chips 🧠. The same chip is also expected to power OpenAI’s first AI-first smartphone 📱🤖.
The Dimensity chips may utilize a dual-NPU design for layered computing and a Neural Shader Scheduler (NSS) that dynamically analyzes machine learning tasks and divides the compute fluidity between the GPU and NPU based on real-time efficiency 🔄.
The processor may feature integrated hardware support for Arm’s Scalable Matrix Extension 2 (SME2), which would significantly accelerate matrix math to achieve faster AI responses with better power efficiency 🔢🔋.
Benchmark numbers 📊
Tipster Digital Chat Station has shared early Geekbench 6 estimates based on engineering samples 📈. While they do not represent the final figures, they do give an idea of where things might land 📍.
According to the leak, the Dimensity 9600 Pro could deliver a single-core score of 4200–4300 on Geekbench 6, and multi-core performance could be around 12000–12500 🔢. For context, the estimated Geekbench scores for the previous generation were 4000 for single-core and 11000 for multi-core, as shared by the tipster. These figures suggest a steady, incremental generational leap for the Dimensity 9600 Pro, rather than a dramatic shift 📈👣.
Upcoming devices with the Dimensity 9600 series chips 🔜📱
Here’s a list of upcoming phones expected to be powered by the upcoming Dimensity chips:
Vivo X500 (Dimensity 9600) 📱
Vivo X500 Pro (Dimensity 9600 Pro) ✨
Oppo Find X10 (Dimensity 9600) 📱
Oppo Find X10 Pro (Dimensity 9600 Pro) ✨
The first smartphone could launch as early as September 2026 🗓️.
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Tech
JBL Live 780NC and Live 680NC Debut 🎉 in India: Featuring True Adaptive ANC, Spatial Audio, and Up to 80 Hours of Battery Life 🔋
JBL has expanded its wireless audio portfolio 🎧 in India with the launch 🚀 of two premium headphones: the JBL Live 780NC and the JBL Live 680NC. Designed for users seeking a blend of style and substance, these new offerings promise immersive sound 🔊, robust active noise cancellation, and exceptional battery life.
Intelligent Audio 🧠: Advanced ANC, Spatial Sound 🪐, and AI-Enhanced Calls 🤖
Catering to different style preferences 🎨, the JBL Live 780NC features a comfortable over-ear design, while the Live 680NC offers a more compact on-ear profile. Under the hood, both models are powered by 40mm dynamic drivers and feature JBL Spatial Sound 3.0, bringing a theater-like depth 🎭 to your music, movies, and podcasts 🍿. Additionally, users can craft a bespoke listening profile using Personi-Fi 3.0, which calibrates the audio output to match their unique hearing sensitivity 👂.
To block out distractions 🛡️, both models leverage JBL’s True Adaptive Noise Cancelling 2.0 technology. The over-ear Live 780NC utilizes a six-microphone array to monitor and neutralize ambient noise, while the on-ear Live 680NC relies on a highly capable four-microphone system. When it comes to voice calls, dual beamforming microphones work in tandem with an AI-driven noise-reduction algorithm to ensure crystal-clear 🔮 conversations, even in bustling environments.
On the connectivity front 🔗, the headphones are equipped with Bluetooth 6.0, multipoint pairing for seamless device switching, and Auracast support. Audiophiles will appreciate the high-resolution wireless audio enabled by LDAC codec support on compatible devices. Battery life 🔋 is another major selling point: both models deliver an impressive 80 hours of playback with ANC off, and up to 50 hours with ANC activated. If you’re in a rush, a quick five-minute charge ⚡ provides up to four hours of listening time.
Pricing and Availability Details 🏷️
The premium 🏆 JBL Live 780NC is priced at Rs 15,999 (approximately $170), while the on-ear JBL Live 680NC comes in at Rs 11,999 (around $130). Both models are available in an array of seven vibrant colorways 🌈: Black, Blue, White, Champagne, Green, Orange, and Purple. Early birds can pre-book 🎟️ the Live 780NC starting June 18 via Amazon and JBL India’s official website to enjoy a limited-time Rs 2,000 discount and a complimentary one-year extended warranty 🛡️.
The JBL Live 780NC is set to officially hit the shelves 🛍️ during Amazon Prime Day 📦, alongside availability at major retail stores. Meanwhile, the Live 680NC will be available for purchase starting July 15.
Tech
Vivo X Fold 6 Set to Redefine Foldables with a 7,000mAh Battery 🔋 and IPX8/IPX9 Durability 🛡️
Vivo has released an exciting new demonstration video 📹 showcasing the real-world capabilities of its highly anticipated Vivo X Fold 6 📱. Rather than simply boasting about raw processing power or camera specs, the brand is shifting the spotlight to the features that truly impact daily use for frequent travelers ✈️ and power users: exceptional battery life 🔋, rugged durability 🛡️, and rock-solid connectivity 📶.
Vivo X Fold 6: Massive Battery 🔋 and Next-Gen Durability Confirmed 🏆
Vivo’s Product Manager, Han Boxiao, officially confirmed that every variant of the Vivo X Fold 6 will be powered by a massive 7,000mAh Blue Ocean battery 🌊. Setting a new industry benchmark 🚀, this cutting-edge foldable is set to be the first smartphone to leverage fifth-generation silicon-anode battery technology, paired with Vivo’s own third-generation semi-solid-state battery tech 🧪 to deliver unprecedented efficiency and longevity.
According to Boxiao, deep, multi-level optimization ⚙️ of the Blue Ocean battery system allows the device to survive up to 9.8 hours under the heavy workloads of Vivo’s Atomic Workbench 🧬. This translates to an impressive 30 percent leap in overall battery life compared to previous generations ⚡.
To prove its rugged credentials, Vivo put the phone through its paces in extreme environments 🌋. The X Fold 6 remained fully operational in freezing temperatures as low as -20°C ❄️, and was even demonstrated functioning seamlessly underwater 🤿. Boasting robust IPX8 and IPX9 water-resistance ratings, the device is built to withstand high-pressure jets and submersion 🧊. Additionally, a newly engineered, lightweight hinge ensures smooth, reliable folding action designed to last for years 🔄.
Uncompromising connectivity is another standout feature 📡. The Vivo X Fold 6 debuts the upgraded Global Signal Amplification System 3.0, powered by a proprietary “1+4” communication chipset architecture 🕹️. This innovative setup combines a dedicated signal amplification chip with four Wi-Fi enhancement chips, specifically engineered to maintain a strong connection in notorious dead zones 🔮.
In a dramatic display of this technology, Vivo demonstrated a crystal-clear voice call made during a skydive 🪂 from an altitude of 4,000 meters—proving the phone’s ability to rapidly lock onto and hold network signals under extreme conditions 🛸. This upgraded system is tailor-made to deliver seamless coverage on high-speed trains 🚄, inside elevators, along remote highways, and in other notoriously difficult signal areas 🍀.
These upgrades build on previously confirmed flagship specs, including a stunning 8.02-inch foldable OLED inner display reaching a peak brightness of 5,000 nits ☀️, the powerhouse Dimensity 9500 Super Edition chipset 💎, and a versatile triple-camera array. This setup features a massive 200-megapixel primary sensor 📸, a 50-megapixel ultra-wide lens, and a 50-megapixel periscope telephoto camera. Notably, it will also be Vivo’s first foldable to support an innovative telephoto extender attachment 🔭.
Buyers will be able to choose from multiple configurations 🛍️, including 12GB+256GB, 12GB+512GB, 16GB+512GB, and a top-tier 16GB+1TB variant 💾. The phone will debut in striking colorways: Blue Cave, Salt Lake, Polar Night, and a premium Black Gold Edition 🎨. The Vivo X Fold 6 is slated for an official launch in China on June 26, with a global rollout expected to follow shortly after in July 🌍.
Tech
Why Next-Gen AI Smartphones May Ditch LPDDR for LLW 🪐
Smartphones 📱 are hitting a major memory bottleneck, and it is not something a simple software update can resolve. While modern mobile processors are fully capable of running large language models (LLMs) locally, on-device AI 🧠 is pushing hardware to its absolute limits.
The real bottleneck lies in current LPDDR memory technology, which struggles to feed data to these processors fast enough to keep up with AI demands. It is this exact challenge 🎯 that forces AI datacenters to rely on ultra-fast High Bandwidth Memory (HBM) ⚡.
To bridge this gap, a new memory standard called LLW (Low Latency Wide DRAM) is currently in development 🧬, promising to solve the mobile bottleneck once and for all 🔮.
LLW: The HBM-Style Solution for Smartphones 🚀
LLW takes a page out of the HBM playbook. HBM achieves blistering speeds ⚡ by stacking multiple memory layers close to the processor and linking them through an incredibly wide interface. This architecture delivers massive bandwidth, potentially performing 10 to 15 times faster 💥 than today’s top-tier LPDDR memory.
However, traditional HBM requires complex packaging and heavy-duty cooling 🧊 that simply won’t fit inside a smartphone. LLW aims to deliver the best of both worlds: offering the high bandwidth and low latency of stacked memory without the thermal and physical space constraints that usually come with it 💎.
Xiaomi 17T and 17T Pro: Early Adopters? 👀
Of course, these early rumors should be taken with a grain of salt 🧂. The current details stem from industry bloggers and tech tipsters rather than official manufacturer roadmaps.
According to a leak from tipster Fixed Focus Digital, LLW memory could slash power consumption by up to 50% 🔋 while simultaneously boosting overall performance by 1.5 times.
We will have to wait a while ⏳ to see this technology in action. The leak indicates that widespread adoption of LLW is still a few years away, with large-scale deployment not expected until the second half of 2027. When it does arrive, Xiaomi and Huawei are rumored to be among the first to adopt it, though neither brand has officially confirmed these plans 🏆.
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